China makes progress in 3-nm chips without advanced lithography tools
Chinese researchers have achieved early progress in developing semiconductor processing nodes below 3-nm, utilizing older lithography technology. This development comes as the United States' sanctions prevent Dutch company ASML from selling its advanced extreme ultraviolet (EUV) lithography machines to Chinese clients.

Briefing Summary
AI-generatedChinese researchers have achieved early progress in developing semiconductor processing nodes below 3-nm, utilizing older lithography technology. This development comes as the United States' sanctions prevent Dutch company ASML from selling its advanced extreme ultraviolet (EUV) lithography machines to Chinese clients. EUV machines are considered essential for manufacturing chips at nodes below 7-nm. This breakthrough represents China's ongoing efforts to establish an independent route to advanced chipmaking in the face of US export restrictions. The progress was reported on September 19, 2026.
Article analysis
Model · rule-basedKey claims
4 extractedASML is barred from selling its state-of-the-art EUV machines to China under current export control rules.
Advanced EUV lithography tools from ASML are blocked for Chinese clients due to US sanctions.
This progress represents China's effort to find alternative chipmaking methods amid US export restrictions.
Chinese researchers are developing 3-nm chips using older lithography technology.