Diamond coating nearly doubles Chinese AI data centre’s cooling efficiency
Chinese researchers at the Ningbo Institute of Industrial Technology of the Chinese Academy of Sciences (CAS) have developed a diamond-copper composite material designed to significantly improve cooling efficiency in AI data centers. The new material is reported to increase cooling efficiency by up to 80%.

Briefing Summary
AI-generatedChinese researchers at the Ningbo Institute of Industrial Technology of the Chinese Academy of Sciences (CAS) have developed a diamond-copper composite material designed to significantly improve cooling efficiency in AI data centers. The new material is reported to increase cooling efficiency by up to 80%. It has already been deployed in an AI computing node in Zhengzhou, Henan province. The development addresses the growing problem of overheating in AI data centers caused by the increased power density and heat output of new-generation chips. This "thermal wall" is hindering further advancements in the global computing industry's AI development.
Article analysis
Model · rule-basedKey claims
4 extractedOverheating is caused by the significantly higher heat output of new-generation chips.
The composite material has already been deployed in an AI computing node in Zhengzhou.
New diamond-copper material can improve cooling efficiency of AI data centres by up to 80 per cent.
Global computing industry’s pursuit of AI breakthroughs is hitting a “thermal wall”.