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Government Sustainable Bond Programme
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Recent Coverage
Hong Kong seeks to raise bond issuance ceiling to HK$900 billion
April 9, 2026
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Infrastructure Bond Programme
organization
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1 co-mentions
Andrew Lai Chi-wah
person
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1 co-mentions
Hong Kong
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Legislative Council
organization
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1 co-mentions
Northern Metropolis
location
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1 co-mentions
Paul Chan Mo-po
person
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1 co-mentions
Robert Lee Wai-Wang
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